United States


11665 West Bradley Road
Milwaukee, WI, 53224
United States

Contact Us Contact Us

Semiconductor Packaging Engineer

Based in Geneva

Working closely with the ASIC development and R&D departments, she/he will be responsible for providing the overall guidance for packaging design in support of LEM projects. Her/his expertise in semiconductors packaging and test technology, notably with both front end and back end assembly processes as well as test equipment, and package handling approaches will allow her/him to drive working with both subcontractors and internal manufacturing in determining optimum process parameters, material selection, and quality requirements, as well as making process and equipment selections.

We offer
  • A challenging position in an open, enthusiastic and dynamic market leading midsize company within an international environment.
  • Good working conditions in a modern, innovative, and technology leading high tech company.


Main tasks
  • Develop best processes & material sets to meet LEM stringent requirements with internal/external partners,
  • Manage LEM technical subcontractor needs for die prep, die attach, wirebond/ FC, encapsulation & finishing,
  • Initiate & maintain LEM specifications including: process FMEA, control plans, production instructions, RMA’s,
  • Responsible for yields, FA’s, 4/8D’s, root cause analysis & corrective actions including poke yoke solutions, continuous improvements, as well as centered process initiatives,
  • Work on cost reduction initiatives including both process and material set optimization in conjunction with subcontracts, internal factories, and customers,
  • Provide on-call services for package and test related questions.
  • Bachelor Degree Mechanical or Electrical Engineering semiconductors oriented, or experience helpful,
  • Minimum 5 years field experience in semiconductor packaging with increasing responsibilities;
  • New product introduction experience a benefit.
  • Understanding of wafer fabrication processes, especially as they relate to packaging.
  • Experienced working with subcontractors.
  • In-depth knowledge of die prep, die bonding, wire bonding, FC, encapsulation, and finishing processes.
  • Knowledge and experience on MSA, SPC, FMEA, Control plans, 4 & 8D is a must.
  • Knowledge of automotive AECQ100 manufacturing is required.
  • Good communication skill in English (written and verbal).
  • Drive projects in a multicultural, multi geography environment.
  • Outstanding analytical and conceptual competences with a pragmatic view to problem solving.
  • Able to multitask, and efficiently manage time.
As soon as possible


One file only.
20 MB limit.
Allowed types: pdf doc docx.
Unlimited number of files can be uploaded to this field.
20 MB limit.
Allowed types: pdf doc docx.